Samsung SM411 Pick and Place Machine

PCB size 510 (L) x 460 (W)
Patch speed 42,000CPH
Mounting range 0402 chip to the largest 14mm IC
Equipment weight 1820kg
Product description: Samsung SM411 Pick and Place Machine, PCB size 510 (L) x 460 (W), Patch speed 42,000CPH, Mounting range 0402 chip to the largest 14mm IC, Equipment weight 1820kg

Samsung SM411 Pick and Place Machine

Chip theoretical speed 42,000CPH
Mounting range 0402 chip to the largest 14mm IC
Positioning accuracy of plus or minus 0.05mm
PCB size 510 (L) x 460 (W)
Equipment Size 1,650 (L) x 1,690 (D) x 1,535 (H)
Maximum power 5.0k VA
Equipment weight 1820kg
The SM411 is based on On Fly, a Samsung patented, fastest-mount mid-speed machine

with dual cantilever architecture for chip components 42,000 CPH,

SOP components 30,000 CPH (IPC9850 standard) World's fastest in its class The patch speed.

And, it is also possible to implement high-precision 50-micron high-precision chip,

which from the minimum 0402 chip to the maximum □ 14mmIC components so far,

can implement the patch.

advantage:
Parallel dual-track, PCB handling time 0 seconds
Very low material loss rate: two ten thousandths
Samsung's unique flight-centered recognition system (Fly Vision)
Feeder component position automatic identification function
Advanced flat wire structure
Anti-static ESD nozzle
New non-stop feeder
PM Manager Management Features:
IPC9850 standard can mount 42,000CPH (Chip 1608)
Dual Manipulator Drive System (12 heads)
In flight recognition system of images
Y-axis dual servo motor drive system
Bilateral standard feeder base
Can be installed 120 8mm belt feeders
Reference point recognition camera
Automatic nozzle replacement device
Color LCD
Double rail transfer system
Rail width automatically adjust
PCB edge clamping device
Feeding process tracking sensor
Windows XP operating system
Order and feed sorting automatic optimization program
A standard nozzle
Samsung SM411 parameters
To the way the flight vision
Number of Spindles 6 Spindles x 2 Gantry
Mounting Speed Flying Vision Chip 1608
SOP 42,000 CPH (IPC9850)
30,000 CPH (IPC9850)
Mounting accuracy Chip ± 50 μ @ 3σ / Chip
(Based on the standard chips)
Narrow pitch mounting 0.1mm (0603) / 0.15mm (1005)
Components range of 0603 ~ □ 14mm Chip, QFP, BGA
(Option: 0402 Please contact us. The more information will be available upon your request.)
Minimum pin pitch (QFP)
Minimum ball pitch (BGA) 0.5mm (QFP) / 0.65mm (BGA)
The maximum height H = 12mm
Board Size (mm) Min 50 (L) x 40 (W)
Maximum 510 (L) x 460 (W)
(Single Lane Mode, 460 (L) Excess: No Buffer)
460 (L) x 250 (W) (Dual Lane Mode)
610 (L) x 460/250 (W) (Option)
PCB thickness 0.38mm ~ 4.2mm
Number of feeders 120ea / 112ea (Feeder changer)
Power Consumption Power consumption AC200 / 208/220/240/380/415 V (50 / 60Hz, 3Phase)
Max. 5.0kVA
Air consumption of 0.5 ~ 0.7MPa (5.1 ~ 7.1kgf / cm2), 300N? / Min
Weight 1,820kg
Dimensions (mm) 1,650 (L) x 1,690 (D) x 1,535 (H)