Yamaha S20 Pick and Place Machine

Speed:200,000 CPH
Applicable PCB:L50×W50mm - L700×W460mm
Weight:1700KG
Dimension:L1,254×W1,687×H1,445mm
Product description: Yamaha S20 Pick and Place Machine, Speed: 200,000 CPH, Applicable PCB:L50×W50mm - L700×W460mm, Weight:1700KG, Dimension:L1,254×W1,687×H1,445mm

Yamaha S20 Pick and Place Machine

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Yamaha S20 Pick and Place Machine

Ultimate Flexibility to realize 3D MID* Placement

 Enhancement to 3D MID

Large board handling capability

Wide ranging component handling capability and high feeder capacity

Ultimate flexibility and fast & easy setup

3D MID: Molded Interconnect Device

Specifications


S20

Board size(with buffer unused)

Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)

Board size(with input and output buffers used)

Min. L50 x W30mm to Max. L540 x W510mm

Board thickness

0.4 - 4.8mm

Board flow direction

Left to right (Std)

Board transfer speed

Max 900mm/sec

Placement speed (12 heads + 2 theta) Opt. Cond.

0.08sec/CHIP (45,000CPH)

Placement accuracy A (?+3?)

CHIP +/-0.040mm

Placement accuracy B (?+3?)

IC +/-0.025mm

Placement angle

+/-180 degrees

Z axis control / Theta axis control

AC servo motor

Component height

Max 30mm*1 (Pre-placed components: max 25mm)

Applicable components

0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)

Component package

8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray

Drawback check

Vacuum check and vision check

Screen language

English, Chinese, Korean, Japanese

Board positioning

Board grip unit, front reference, auto conveyor width adjustment

Component types

Max 180 types (8mm tape), 45 lanes x 4

Transfer height

900 +/- 20mm

Machine dimensions, weight

L1750xD1750xH1420mm, Approx. 1,500kg

*1 Board thickness + Component height = Max 30mm

Specifications and appearance are subject to change without prior notice.

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